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Effect of Sn Grain c-Axis on Cu Atomic Motion in Cu Reinforced Composite Solder Joints Under Electromigration

Published Online: 2020-01-02

Published Print: 2020-03

Authors

Wang, Yan

Wang, Yishu

Ma, Limin

Han, Jing

Guo, Fu https://orcid.org/0000-0003-4902-4313
Funding

Funding for this research was provided by:

Beijing Natural Science Foundation (2172006, 2172009)

Science and Technology Project of Beijing Municipal Education Commission (SQKM201610005024)

National Natural Science Foundation of China (51425101, 51621003)

National Key Research and Development Program of China (2017YFB0305701)
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Text and Data Mining valid from 2020-01-02

Version of Record valid from 2020-01-02
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Article History

Received: 23 October 2018

Accepted: 11 December 2019

First Online: 2 January 2020

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