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A Model for Intermetallic Growth in Thin Sn Joints Between Cu Substrates: Application to Solder Microjoints

Published Online: 2020-02-27

Published Print: 2020-05

Authors

Arafat, Y.

Yang, H.

Dutta, I.

Kumar, P. A.

Datta, B.
Funding

Funding for this research was provided by:

Missile Defense Agency
License Information

Text and Data Mining valid from 2020-02-27

Version of Record valid from 2020-02-27
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Article History

Received: 14 October 2019

Accepted: 12 February 2020

First Online: 27 February 2020

Document is current