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Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces

Published Online: 2020-02-28

Published Print: 2020-05

Authors

Zhang, Qingke https://orcid.org/0000-0002-8324-9762
Hu, Fangqin

Song, Zhenlun
Funding

Funding for this research was provided by:

Natural Science Foundation of Ningbo Municipality (2018A610058)

Natural Science Foundation of Zhejiang Province (LQ20E050005)
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Text and Data Mining valid from 2020-02-28

Version of Record valid from 2020-02-28
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Article History

Received: 31 August 2019

Accepted: 19 February 2020

First Online: 28 February 2020

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