Crossmark

Stabilization of the ζ-Cu10Sn3 Phase by Ni at Soldering-Relevant Temperatures

Crossref DOI link: https://doi.org/10.1007/s11664-020-08036-7

Published Online: 2020-03-16

Published Print: 2020-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wieser, C.

Hügel, W.

Martin, S.

Freudenberger, J.

Leineweber, A. https://orcid.org/0000-0002-8948-8975
License Information

Text and Data Mining valid from 2020-03-16

Version of Record valid from 2020-03-16
More Information

Article History

Received: 6 December 2019

Accepted: 21 February 2020

First Online: 16 March 2020