Investigation of Various Bumps and Redistribution Lines to Inhibit Protected Silicon Nitride Cracks in High Pattern Density Chip Package
Crossref DOI link: https://doi.org/10.1007/s11664-020-08310-8
Published Online: 2020-07-11
Published Print: 2020-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ho, Ching-Yuan http://orcid.org/0000-0002-6245-4361
Cheng, Hsin
Chang, Yuan-Chih
Lee, Hwa-Teng
Text and Data Mining valid from 2020-07-11
Version of Record valid from 2020-07-11
Article History
Received: 2 March 2020
Accepted: 30 June 2020
First Online: 11 July 2020