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Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure

Published Online: 2020-08-13

Published Print: 2020-10

Authors

Gao, Li-Yin

Cui, Xian-Wei

Tian, Fei-Fei

Liu, Zhi-Quan https://orcid.org/0000-0001-7097-8977
Funding

Funding for this research was provided by:

National Key R&D Program of China (2017YFB0305700)
License Information

Text and Data Mining valid from 2020-08-13

Version of Record valid from 2020-08-13
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Article History

Received: 2 March 2020

Accepted: 29 July 2020

First Online: 13 August 2020

Conflict of interest

: The authors declare that they have no conflict of interest.

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