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Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration

Published Online: 2020-09-10

Published Print: 2020-11

Authors

Wang, Yiteng

Watanabe, Atom O. https://orcid.org/0000-0003-1577-6066
Ogura, Nobuo

Raj, Pulugurtha Markondeya

Tummala, Rao
License Information

Text and Data Mining valid from 2020-09-10

Version of Record valid from 2020-09-10
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Article History

Received: 26 March 2020

Accepted: 6 August 2020

First Online: 10 September 2020

Conflict of interest

: The authors declare that they have no conflict of interest.

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