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Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature

Crossref DOI link: https://doi.org/10.1007/s11664-020-08410-5

Published Online: 2020-08-27

Published Print: 2021-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Chen, Chuantong https://orcid.org/0000-0002-2365-4387
Choe, Chanyang

Kim, Dongjin

Suganuma, Katsuaki
Funding

Funding for this research was provided by:

Advanced Low Carbon Technology Research and Development Program (JPMJAL1610)

Japan Society for the Promotion of Science (19121587)

New Energy and Industrial Technology Development Organization (JPNP14004)
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Text and Data Mining valid from 2020-08-27

Version of Record valid from 2020-08-27
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Article History

Received: 19 April 2020

Accepted: 11 August 2020

First Online: 27 August 2020

Conflict of interest

: The authors declare that they have no conflict of interest.

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