Effect of Active Al on the Microstructure and Mechanical Properties of a Mo/Sn-Based Solder Interface: First-Principles Calculation and Experimental Study
Crossref DOI link: https://doi.org/10.1007/s11664-020-08429-8
Published Online: 2020-08-28
Published Print: 2020-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Hao
Guo, Weibing
Xue, Haitao
Zhang, Xiaoming
Funding for this research was provided by:
Natural Science Foundation of Hebei Province (E2019202407)
Text and Data Mining valid from 2020-08-28
Version of Record valid from 2020-08-28
Article History
Received: 28 February 2020
Accepted: 17 August 2020
First Online: 28 August 2020