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Influencing Factors of Fatigue Life of Nano-Silver Paste in Chip Interconnection

Crossref DOI link: https://doi.org/10.1007/s11664-020-08501-3

Published Online: 2020-10-12

Published Print: 2021-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Yang, Hui https://orcid.org/0000-0001-6512-4045
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Text and Data Mining valid from 2020-10-12

Version of Record valid from 2020-10-12
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Article History

Received: 2 July 2020

Accepted: 19 September 2020

First Online: 12 October 2020

Conflict of interest

: The authors declare that they have no conflict of interest.