Influencing Factors of Fatigue Life of Nano-Silver Paste in Chip Interconnection
Crossref DOI link: https://doi.org/10.1007/s11664-020-08501-3
Published Online: 2020-10-12
Published Print: 2021-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Hui http://orcid.org/0000-0001-6512-4045
Text and Data Mining valid from 2020-10-12
Version of Record valid from 2020-10-12
Article History
Received: 2 July 2020
Accepted: 19 September 2020
First Online: 12 October 2020
Conflict of interest
: The authors declare that they have no conflict of interest.