Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)
Crossref DOI link: https://doi.org/10.1007/s11664-020-08525-9
Published Online: 2020-11-05
Published Print: 2021-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Depiver, Joshua A. http://orcid.org/0000-0001-8773-2535
Mallik, Sabuj
Amalu, Emeka H.
Funding for this research was provided by:
University of Derby
Text and Data Mining valid from 2020-11-05
Version of Record valid from 2020-11-05
Article History
Received: 10 May 2020
Accepted: 25 September 2020
First Online: 5 November 2020
Conflict of interest
: The authors declare that they have no conflict of interest.