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Electrical and Microstructural Reliability of Pressureless Silver-Sintered Joints on Silicon Carbide Power Modules Under Thermal Cycling and High-Temperature Storage

Crossref DOI link: https://doi.org/10.1007/s11664-020-08698-3

Published Online: 2021-01-11

Published Print: 2021-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Hong, Won Sik https://orcid.org/0000-0001-8398-177X
Kim, Mi Song

Hong, Kyoung-Kook
Funding

Funding for this research was provided by:

Korea Evaluation Institute of Industrial Technology (10063263)
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Text and Data Mining valid from 2021-01-11

Version of Record valid from 2021-01-11
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Article History

Received: 13 July 2020

Accepted: 10 December 2020

First Online: 11 January 2021

Conflict of interest

: The authors declare that they have no conflict of interest.

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