Investigating the Reliability of SnAgCu Solder Alloys at Elevated Temperatures in Microelectronic Applications
Crossref DOI link: https://doi.org/10.1007/s11664-021-08968-8
Published Online: 2021-05-13
Published Print: 2021-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ekpu, Mathias http://orcid.org/0000-0003-1799-7559
Text and Data Mining valid from 2021-05-13
Version of Record valid from 2021-05-13
Article History
Received: 8 February 2021
Accepted: 20 April 2021
First Online: 13 May 2021
Conflict of interest
: The author declare that there is no conflict of interest.