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Minor Ge Addition to Suppress the IMC Growth in Interfacial Reactions of Co with Sn-Ag-Ge and Sn-Ag-Cu-Ge Solders

Published Online: 2022-02-08

Published Print: 2022-04

Authors

Wang, Chao-hong https://orcid.org/0000-0002-4137-5584
Chen, Ke-Hsing

Tsai, Jiun-Yu
Funding

Funding for this research was provided by:

Ministry of Science and Technology, Taiwan (MOST 109-2221-E-194-007)
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Text and Data Mining valid from 2022-02-08

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Article History

Received: 24 August 2021

Accepted: 10 January 2022

First Online: 8 February 2022

Conflict of interest

: The authors declare that they have no conflict of interest.

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