Predicting the Cu6Sn5 Growth Kinetics During Thermal Aging of Cu-Sn Solder Joints Using Simplistic Kinetic Modeling
Crossref DOI link: https://doi.org/10.1007/s11664-022-09643-2
Published Online: 2022-05-11
Published Print: 2022-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Roy, Ankita
Luktuke, Amey
Chawla, Nikhilesh
Ankit, Kumar http://orcid.org/0000-0001-5283-5139
Funding for this research was provided by:
National Science Foundation (1763128, 2020277)
Text and Data Mining valid from 2022-05-11
Version of Record valid from 2022-05-11
Article History
Received: 25 January 2022
Accepted: 5 April 2022
First Online: 11 May 2022
Conflict of interest
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