Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer. Part 2: Quantitative Compositional Analysis of Intermetallic Compound Reaction Layers
Crossref DOI link: https://doi.org/10.1007/s11664-022-10034-w
Published Online: 2022-10-27
Published Print: 2023-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Vianco, P. T.
Kilgo, A. C.
McKenzie, B. B.
Grant, R. P.
Williams, S.
Text and Data Mining valid from 2022-10-27
Version of Record valid from 2022-10-27
Article History
Received: 6 June 2022
Accepted: 10 October 2022
First Online: 27 October 2022
Conflict of interest
: The authors declare that they have no conflict of interest.