Effects of High-Density Current on the Reliability of Ni-Sn Solid–Liquid Interdiffusion Joints with Al Interlayer
Crossref DOI link: https://doi.org/10.1007/s11664-022-10059-1
Published Online: 2022-11-11
Published Print: 2023-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Satoh, Toshikazu https://orcid.org/0000-0001-5287-3426
Wakasugi, Makoto
Usui, Masanori
Text and Data Mining valid from 2022-11-11
Version of Record valid from 2022-11-11
Article History
Received: 17 February 2022
Accepted: 27 October 2022
First Online: 11 November 2022
Conflict of interest
: The authors declare that they have no conflict of interest.