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Phase Field Simulation of Intermetallic Compound Evolution at the Interface of Copper–Tin Coating Under Thermal–Mechanical–Electrical Diffusion Coupling

Crossref DOI link: https://doi.org/10.1007/s11664-023-10304-1

Published Online: 2023-03-03

Published Print: 2023-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhang, Long

Li, Junfeng

Yin, Limeng

Zhang, Hehe

Xu, Manru

Yao, Zongxiang
Funding

Funding for this research was provided by:

Major Research Plan (52175288)

Young Scientists Fund (12102074)

Natural Science Foundation Project of Chongqing, Chongqing Science and Technology Commission (cstc2021jcyj-msxmX0845)

Science and Technology Research Program of Chongqing Municipal Education Commission (KJQN201901517)

Chongqing Talent Plan Project (cstc2022ycjh-bgzxm0014)
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Text and Data Mining valid from 2023-03-03

Version of Record valid from 2023-03-03
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Article History

Received: 19 August 2022

Accepted: 13 February 2023

First Online: 3 March 2023

Conflict of interest

: No conflict of interest exits in this manuscript, and the manuscript is approved by all authors for publication. This work described was original research that has not been published previously, and is not under consideration for publication elsewhere, in whole or in part. All the authors listed have approved the manuscript.

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