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A Technology for Bonding Cu Wires with Cu Pads: Structure and Electrical Fatigue Mechanism of Fine Micro-alloyed Cu Wires

Published Online: 2023-04-13

Published Print: 2023-06

Authors

Zhao, Jun-Ren

Chen, Yu-Jen

Hung, Fei-Yi
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Text and Data Mining valid from 2023-04-13

Version of Record valid from 2023-04-13
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Article History

Received: 26 October 2022

Accepted: 10 March 2023

First Online: 13 April 2023

Conflict of interest

: On behalf of all authors, the corresponding author states that there is no conflict of interest.

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