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Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging

Published Online: 2023-04-23

Published Print: 2023-07

Authors

Depiver, Joshua A. https://orcid.org/0000-0001-8773-2535
Mallik, Sabuj

Amalu, Emeka H.
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Text and Data Mining valid from 2023-04-23

Version of Record valid from 2023-04-23
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Article History

Received: 2 November 2022

Accepted: 16 March 2023

First Online: 23 April 2023

Conflict of interest

: The authors declare no conflict of interest.

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