Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging
Crossref DOI link: https://doi.org/10.1007/s11664-023-10394-x
Published Online: 2023-04-23
Published Print: 2023-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Depiver, Joshua A. http://orcid.org/0000-0001-8773-2535
Mallik, Sabuj
Amalu, Emeka H.
Text and Data Mining valid from 2023-04-23
Version of Record valid from 2023-04-23
Article History
Received: 2 November 2022
Accepted: 16 March 2023
First Online: 23 April 2023
Conflict of interest
: The authors declare no conflict of interest.