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A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue

Crossref DOI link: https://doi.org/10.1007/s11664-023-10402-0

Published Online: 2023-04-20

Published Print: 2023-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Kurniawan, R. Rakhmat

Sayed, Biju Theruvil

Sari, Arif

Luna, Jorge Paucar

Kareem, A. K.

Hussien, Naseer Ali
License Information

Text and Data Mining valid from 2023-04-20

Version of Record valid from 2023-04-20
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Article History

Received: 22 January 2023

Accepted: 20 March 2023

First Online: 20 April 2023

Conflict of interest

: The authors declare that they have no conflicts of interests.

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