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Thermal, Microstructural, and Mechanical Features of Bi-Containing Sn-1Ag-0.5Cu Lead-Free Solders

Published Online: 2023-04-27

Published Print: 2023-07

Authors

Zahran, H. Y.

Abd El-Rehim, A. F. https://orcid.org/0000-0002-9170-5641
Mahmoud, A. S.
Funding

Funding for this research was provided by:

King Khalid University (RGP2/325/44)
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Text and Data Mining valid from 2023-04-27

Version of Record valid from 2023-04-27
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Article History

Received: 6 December 2022

Accepted: 29 March 2023

First Online: 27 April 2023

Conflict of interest

: The authors declare that there is no conflict of interest regarding the publication of this paper.

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