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Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling

Published Online: 2023-08-29

Published Print: 2023-11

Authors

Wang, Xianyu

He, Liang https://orcid.org/0000-0003-4443-5623
Chen, Hua

Xiao, Xiaolei
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (61106062)

Fundamental Research Funds for the Central Universities (JB181409)

Equipment Pre-Research Project of China (41402010102)
License Information

Text and Data Mining valid from 2023-08-29

Version of Record valid from 2023-08-29
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Article History

Received: 2 November 2022

Accepted: 31 July 2023

First Online: 29 August 2023

Conflict of interest

: The authors declare that they have no conflict of interest.

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