In-Line Test Structures and Non-destructive Characterization of Electromigration-Driven Phase Evolution in Microscale Solder Joints
Crossref DOI link: https://doi.org/10.1007/s11664-024-11043-7
Published Online: 2024-04-17
Published Print: 2024-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jois, Chetan
Chou, Pei-En
Subbarayan, Ganesh https://orcid.org/0000-0003-0462-1130
Text and Data Mining valid from 2024-04-17
Version of Record valid from 2024-04-17
Article History
Received: 30 January 2024
Accepted: 11 March 2024
First Online: 17 April 2024
Conflict of interest
: The authors of the paper declare that there is no Conflict of interest regarding the publication of this paper.