Crossmark

Microcracking in On-Chip Interconnect Stacks: FEM Simulation and Concept for Fatigue Test

Published Online: 2024-05-09

Published Print: 2024-08

Authors

Weitz, Stefan https://orcid.org/0000-0002-5676-3555
Clausner, André

Zschech, Ehrenfried
Funding

Funding for this research was provided by:

Fraunhofer-Institut für Keramische Technologien und Systeme IKTS
License Information

Text and Data Mining valid from 2024-05-09

Version of Record valid from 2024-05-09
More Information

Article History

Received: 15 December 2023

Accepted: 29 March 2024

First Online: 9 May 2024

Conflict of interest

: The authors declare that they have no conflict of interest.

Document is current