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Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling

Crossref DOI link: https://doi.org/10.1007/s11664-024-11235-1

Published Online: 2024-07-02

Published Print: 2024-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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