The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints
Crossref DOI link: https://doi.org/10.1007/s11664-024-11264-w
Published Online: 2024-06-28
Published Print: 2024-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bi, Yinghao
Guo, Weiqi
Wang, Shaobin
Zhang, Weiwei
Wu, Ping
Text and Data Mining valid from 2024-06-28
Version of Record valid from 2024-06-28
Article History
Received: 17 March 2024
Accepted: 11 June 2024
First Online: 28 June 2024
Conflict of interest
: The authors declare that they have no conflict of interest.