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Understanding the Role of Near-Junction Diamond Heat Spreaders in Packaged 20-Gate GaN HEMT Chips via Thermal Simulation

Published Online: 2024-07-08

Published Print: 2024-09

Authors

Ridzwan, M. N. A. M.

Abdullah, M. F. https://orcid.org/0000-0001-6911-0716
Yussof, A. M. M.

Aziz, N. A. https://orcid.org/0000-0001-8271-5066
Lee, H. W. https://orcid.org/0000-0003-4521-7951
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Text and Data Mining valid from 2024-07-08

Version of Record valid from 2024-07-08
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Article History

Received: 21 March 2024

Accepted: 20 June 2024

First Online: 8 July 2024

Conflict of interest

: The authors declare that they have no conflict of interest.

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