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Effect of Annealing Treatment on Electromigration Resistance of Low-Temperature Sn-57Bi-1Ag Solder Interconnect

Published Online: 2024-09-05

Published Print: 2024-11

Authors

Chen, J. L.

Wang, S. B.

Ren, J.

Huang, M. L. https://orcid.org/0000-0003-3261-9900
Funding

Funding for this research was provided by:

Science and Technology Plan of Liaoning Province (2022JH2/101300260)

National Natural Science Foundation of China (52350321, U1837208)
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Text and Data Mining valid from 2024-09-05

Version of Record valid from 2024-09-05
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Article History

Received: 7 May 2024

Accepted: 20 August 2024

First Online: 5 September 2024

Conflict of interest

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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