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Study on Material Properties and Copper-to-Copper Wire Bonding of Cu-Pt-Au-Pd Fine Micro-Alloyed Wires

Published Online: 2024-09-28

Published Print: 2024-12

Authors

Chang, Yi-Tze

Hung, Fei-Yi

Wu, Bo-Ding
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Text and Data Mining valid from 2024-09-28

Version of Record valid from 2024-09-28
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Article History

Received: 17 June 2024

Accepted: 6 September 2024

First Online: 28 September 2024

Conflict of interest

: All authors declare that they have no conflict of interest relevant to this article.

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