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Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging

Published Online: 2025-01-16

Published Print: 2025-03

Authors

Lee, Dong-Bok

Seo, Young-Jin

Yoon, Jeong-Won https://orcid.org/0000-0001-8708-542X
Funding

Funding for this research was provided by:

National Research Foundation of Korea (2021R1A2C1009714)

National Research Foundation of Korea (RS-2023-00247545)
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Text and Data Mining valid from 2025-01-16

Version of Record valid from 2025-01-16
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Article History

Received: 22 October 2024

Accepted: 2 January 2025

First Online: 16 January 2025

Conflict of interest

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper. There is no conflict of interest.

: The authors declare that they have no use of AI and AI-assisted technologies in the writing process.

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