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Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling

Published Online: 2025-02-03

Published Print: 2025-04

Authors

Hsieh, Chen-Lin https://orcid.org/0000-0003-0686-8794
Coyle, Richard J.

Gourlay, Christopher M.
Funding

Funding for this research was provided by:

Engineering and Physical Sciences Research Council (EP/R018863/1)
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Text and Data Mining valid from 2025-02-03

Version of Record valid from 2025-02-03
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Article History

Received: 23 July 2024

Accepted: 3 January 2025

First Online: 3 February 2025

Conflict of interest

: The authors declare that they have no conflict of interest.

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