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Analysis of Threading Edge Dislocation Low-Angle Grain Boundary Network Distributions in 4H-SiC Wafers Through Synchrotron X-ray Topography and Ray-Tracing Simulation

Crossref DOI link: https://doi.org/10.1007/s11664-025-11793-y

Published Online: 2025-02-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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