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Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys

Published Online: 2025-03-12

Published Print: 2025-05

Authors

Sungkhaphaitoon, Phairote https://orcid.org/0000-0002-4878-3011
Chantaramanee, Suchart
Funding

Funding for this research was provided by:

National Science, Research and Innovation Fund (NSRF), and Prince of Songkla University (SCI6701304S)
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Text and Data Mining valid from 2025-03-12

Version of Record valid from 2025-03-12
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Article History

Received: 11 November 2024

Accepted: 19 February 2025

First Online: 12 March 2025

Conflict of interest

: The authors declare that they have no conflict of interest.

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