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Retraction Note: Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach

Crossref DOI link: https://doi.org/10.1007/s11664-025-11938-z

Published Online: 2025-04-11

Published Print: 2025-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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