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A Study of the Application Characteristics of Surface Micro-alloyed Fine Pd/Au-Coated Cu Wire and Wire Bonding Reliability of Cu Pad

Published Online: 2025-05-09

Authors

Hsu, Chung-Kai

Hung, Fei-Yi https://orcid.org/0000-0001-5432-0980
Wu, Bo-Ding
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Text and Data Mining valid from 2025-05-09

Version of Record valid from 2025-05-09
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Article History

Received: 14 May 2024

Accepted: 11 April 2025

First Online: 9 May 2025

Conflict of interest

: The authors declare no conflicts of interest.

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