Crossmark

A Machine Learning Framework with Shapley’s Additive Explanations to Assess Solder Joint Reliability for Electronic Packaging

Published Online: 2025-07-10

Published Print: 2025-09

Authors

Qasaimeh, Qais

Li, Haoran

Hamasha, Saad

Liu, Jia https://orcid.org/0000-0003-0549-011X
Funding

Funding for this research was provided by:

U.S. Department of Defense (2021-421)
License Information

Text and Data Mining valid from 2025-07-10

Version of Record valid from 2025-07-10
More Information

Article History

Received: 5 February 2025

Accepted: 26 May 2025

First Online: 10 July 2025

Declarations

:

: The authors have no relevant financial or non-financial interests to disclose.

Document is current