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Effect of Operating Ambient Temperatures on Degradation of Solder Joints in IGBT Power Module

Published Online: 2025-06-19

Published Print: 2025-08

Authors

Nebo, Sunday E. https://orcid.org/0009-0001-5906-0150
Amalu, Emeka H.

Hughes, David J.
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Text and Data Mining valid from 2025-06-19

Version of Record valid from 2025-06-19
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Article History

Received: 18 March 2025

Accepted: 26 May 2025

First Online: 19 June 2025

Declarations

:

: The authors declare that they have no conflict of interest.

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