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Low-Temperature Cu–Cu Bonding in Ambient Air via Glycerol-Assisted Sintering of Cu Nanowire Arrays

Published Online: 2025-11-22

Published Print: 2026-02

Authors

Jiang, H. https://orcid.org/0000-0002-8233-5749
Zhu, Y. B.

Xu, Y. H.
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (62404001)

University Synergy Innovation Program of Anhui Province (GXXT-2022-080)
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Text and Data Mining valid from 2025-11-22

Version of Record valid from 2025-11-22
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Article History

Received: 31 July 2025

Accepted: 4 November 2025

First Online: 22 November 2025

Conflict of interest

: The authors declare no conflict of competing interests.

: Not applicable.

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