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Reactive Sputtering of SiCN Films: Process Optimization and Bonding Behavior for Cu Hybrid Bonding

Published Online: 2025-11-18

Published Print: 2026-01

Authors

Choi, Junyoung

Jang, Suin

Kim, Sarah Eunkyung https://orcid.org/0000-0001-5210-3819
Funding

Funding for this research was provided by:

K-Chips (RS-2023-00236091)

NRF (RS-2025-25441264)
License Information

Text and Data Mining valid from 2025-11-18

Version of Record valid from 2025-11-18
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Article History

Received: 19 September 2025

Accepted: 5 November 2025

First Online: 18 November 2025

Conflict of interest

: The authors declare no conflict of interest.

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