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A Micro-alloying Strategy for Enhancing Bond Wire Reliability in IGBT Modules: Performance of Cu-Zn-Si versus Conventional Copper Wires

Published Online: 2025-12-16

Published Print: 2026-02

Authors

Chan, Yi-An

Huang, Bo-Chin

Hung, Fei-Yi https://orcid.org/0000-0001-5432-0980
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Text and Data Mining valid from 2025-12-16

Version of Record valid from 2025-12-16
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Article History

Received: 14 May 2025

Accepted: 5 November 2025

First Online: 16 December 2025

Conflict of Interest

: The authors declare that they have no known conflicts of interest or personal relationships that could have appeared to influence the work reported in this paper.

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