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Identification of Stress–Strain Relation in Uniaxial Tension of Sn-3.0Ag-0.5Cu Solder Based on Digital Image Correlation

Published Online: 2025-12-24

Published Print: 2026-02

Authors

Kim, Minki

Chae, Yujin

Kim, Min-Su https://orcid.org/0000-0002-6249-9578
Funding

Funding for this research was provided by:

the Advanced Institute of Convergence Technology (AICT-03-TB1)

Korea Institute of Industrial Technology (JE-25-0006)
License Information

Text and Data Mining valid from 2025-12-24

Version of Record valid from 2025-12-24
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Article History

Received: 28 August 2025

Accepted: 8 December 2025

First Online: 24 December 2025

Conflict of interest

: The authors declare that they have no conflicts of interest.

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