Wan, Yiran
Zhang, Bingbing
Guo, Bingbo
Wu, Jingyuan
Gu, Yi
Wu, Liangcai https://orcid.org/0000-0003-3734-8417
Funding for this research was provided by:
the Science and Technology Council of Shanghai (No. 22ZR1402200)
the National Natural Science Foundation of China (No. 61874151)
the Open Research Fund of the State Key Laboratory of Materials for Integrated Circuits (No. NKLJC-K2023-08)
Article History
Received: 24 November 2025
Accepted: 4 May 2026
First Online: 14 May 2026
Conflict of interest
: The authors declare that they have no conflict of interest.