Electrical Conductivity, Thermal Stability, and Lattice Defect Evolution During Cyclic Channel Die Compression of OFHC Copper
Crossref DOI link: https://doi.org/10.1007/s11665-014-1359-z
Published Online: 2014-12-12
Published Print: 2015-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Satheesh Kumar, S. S.
Raghu, T.
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