Electrophoretic Deposition of Cu-SiO2 Coatings by DC and Pulsed DC for Enhanced Surface-Mechanical Properties
Crossref DOI link: https://doi.org/10.1007/s11665-015-1834-1
Published Online: 2015-12-17
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Maharana, H. S.
Lakra, Suprabha
Pal, S.
Basu, A.
Text and Data Mining valid from 2015-12-17
