Copper Deposits with High Tensile Strength and Elongation Electroformed in an Ultra-Low-Concentration Sulfate Bath without Additives
Crossref DOI link: https://doi.org/10.1007/s11665-016-2494-5
Published Online: 2017-02-01
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shen, Chunjian
Zhu, Zengwei
Zhu, Di
Ren, Jianhua
License valid from 2017-02-01