Influence of Cu Nanoparticles on Microstructure and Mechanical Properties of Sn0.7Ag0.5Cu-BiNi/Cu Solder Joint
Crossref DOI link: https://doi.org/10.1007/s11665-017-2528-7
Published Online: 2017-02-10
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ban, G. F.
Sun, F. L.
Fan, J. J.
Liu, Y.
Cong, S. N.
License valid from 2017-02-10
