A Feasibility Study of Applying SS 307Si Buffer Layer for Mitigating the Hot Cracking of Ni-Based Weld Overlay
Crossref DOI link: https://doi.org/10.1007/s11665-017-2817-1
Published Online: 2017-07-10
Published Print: 2017-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tsai, Kun-Chao https://orcid.org/0000-0001-6784-9357
Jeng, Sheng-Long
License valid from 2017-07-10