High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal
Crossref DOI link: https://doi.org/10.1007/s11665-017-2935-9
Published Online: 2017-09-25
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Biqiang
Zhang, Guifeng
Zhang, Linjie
Xu, Tingting
License valid from 2017-09-25