The Mechanical and Microstructural Changes of Sn-Ag-Bi Solders with Cooling Rate and Bi Content Variations
Crossref DOI link: https://doi.org/10.1007/s11665-017-3104-x
Published Online: 2017-12-21
Published Print: 2018-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Abd El-Rehim, A. F.
Zahran, H. Y.
AlFaify, S.
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